Applications
- Wafer cleaning
- Mask Cleaning
- CMP (chemical mechanical polishing)
- Development
- Etching
- Photoresist stripping
- Lift-off
- Lens cleaning
- Precision cleaning of display screen and other microelectronic industries
Megasonic cleaning uses higher frequency ultrasonic energy in mega hertz scale to boost removal of submicron particles from substrates and chemical reactions. Compared to low frequency ultrasonic cavitations, megasonic cavitations effect can give smaller particles removal as well as less damage on the substrates. The batch type megasonic plate can be easily assembled into process tank to build a batch type megasonic cleaning system for wafers.
Specifications
- Frequency: 1000 kHz, 750 kHz
- Max. Power: 1200 - 4800 W
- Max. Intensity: 5.5W/cm2
- Plate Material: SUS316L, Quartz
- Housing Material: PVC
- Suitable Wafer Sizes: 6”, 8”, 12”
- Liquid Temperature: <70°C
Benefits
- The megasonic vibrating plate can be directly installed at the bottom of the cleaning tank for secondary development
- Megasonic emission sound field is evenly distributed to improve cleaning uniformity
- Extremely low ultrasonic cavitation effect, no damage to device surface
- High power megasonic transducer, the surface sound intensity of vibrating plate can reach more than 5w/cm2
- Quartz or sapphire coupling technology, no risk of impurities falling off the device
- It can be made of non-metallic high corrosion resistant materials, and is suitable for various acid-base and organic solvents
- Unique transducer bonding technique provides higher stability and durability.
- Megasonic generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive
