CMP Process Training - Module 7:
Advanced topics in CMP
- Heat transfer mechanisms in rotary polishers
- Differences in temperature and slurry age re: multi-point vs. single-point slurry injection on IC and Fujibo pads
- Pad bulk and surface mechanical properties
- Some of the ramifications of migrating to 450 mm wafers
- Force clusters and the hidden orbits within them
- Fluid dynamic ramifications
- Wafer attitude (i.e. altitude, pitch and bank) during polishing
- Wafer curvature during polishing
- Detecting differences in tungsten film structure while polishing
- Determining “instantaneous” removal rates in copper and tungsten polishing