CMP-Training - Module 2:
Definitions of terms
- The CMP module
- Step height and local planarity
- Local vs. global planarity
- Pattern density vs. step height
- Wafer-level vs. die-level planarity
- Planarization length
- Dishing, erosion, field oxide loss, edge-over-erosion
- Methods of measuring the above
- Effects on electrical properties
- The STI process steps
- Asperity filtering
- STI CMP simulations and time-elapsed evolution re: PL and PE
- More on asperity filtering
- The dual-damascene structure